Steinbeis Innovation Center Development Technology


  • Scanning Electron Microscopy (SEM with SE, BSE, EDX detector)
    Surface layer, microstructure, fractured surface, or wear studies, analysis of thin layers and composites, determination of materials, particle counts, etc.
  • Metallurgy
    The research center also has equipment for removing metallurgical microsections which can be analyzed in detail using a light microscope or SEM.
  • Optical surface measurement (depths of up to 6.0 nm)
    High resolution surface layer and roughness measurements, 3D material scans, wafer measurement, particle counting, wear measurement, etc.
  • Analysis: High-speed camera and high-end thermography system with cooled sensor
    Oscillation and process analysis, quality assurance, testing of materials, research and development, technical documentation, etc.
  • Mechanical development and design
  • Strong experience with machine and equipment design
  • Consulting
    • Product development based on function and cost aspects
    • Value analysis
    • FMEA moderation
    • Introduction of classification systems

Key Areas

  • Diamond wire technology
  • Damage analysis
  • Surface analysis
  • Thermography
  • Optical movement and oscillation analysis
  • Machine and equipment development
  • Consulting (classification systems, value analysis, product development)

Project Examples

  • Value analysis for a packing machine – reduction of manufacturing costs by 25%
  • Implementation of a classification system for companies in the machine tool industry, conveyor technology, and plant construction
  • Consulting on the development of a multi-spindle 5-axle machining center
  • Development of 3 fundamentally different diamond wire saws
  • Optimization of a tempering system for thermoplastic dressing materials
  • Development of a connection device for extremely thin diamond wires
  • Consulting on the development of diamond wire


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Friedrich-List-Str. 18, D-78727 Oberndorf
Phone: +49 7423 8758-348
Management: Dominik Vogel, B.Sc.
(Stand: 07/03/2023)

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