Steinbeis Transfer Center Heat Management in Electronics

• Consulting
• Applied research and development

• Metrology-based thermal analysis
  • Quantitative analysis of the thermal properties and thermal diffusivity of solids, liquids, and gases (all common methods)
  • Thermomechanical analysis
  • Determination of thermal contact resistance
  • Measurement of thermal resistance using the thermal transient method
  • Calorimetric measurement, determination of heat capacities
  • Service life testing using modeling, environmental simulations (power cycling, vibration testing, temperature storage, thermal cycling tests)
  • Heatable wind tunnel (15 - 125°C, 0.3 - 15 m/s) measurement volume 1 sqm
• Thermal simulation calculations
  • Thermal analysis based on numerical and analytical calculations
  • System and component level
• Product development
  • Development of innovative cooling concepts
  • Support with the selection of materials
• Construction of thermal testing equipment
• Running of workshops and seminars (in German or English, also in-house) on thermal management in electronics

Steinbeis Transfer Magazine

• “We feel most comfortable in the field of heat management” (Transfer 4/2018)
  An interview with Professor Dr.-Ing. Andreas Griesinger, director of the Steinbeis Transfer Center for Heat Management in Electronics

Yearbook Steinbeis Foundation´s Transfer Award – Löhn Award

• Pioneering Measuring System for Characterizing Thermal Interface Materials (Löhn Award 2013)

Videos

• Pioneering Measuring System for Characterizing Thermal Interface Materials (2013)